Your mission

Are you an experienced packaging expert passionate about advancing the field of photonics and quantum applications? We are seeking a Team Lead Photonic Packaging Engineer to head our packaging efforts. In this hands‑on leadership role, you will guide a small, dedicated team of engineers and oversee the complete packaging assembly of our single‑photon detectors. You will be responsible for tackling the unique challenges of packaging Photonic Integrated Circuits (PICs) for operation at cryogenic temperatures (2 K).

Key Responsibilities

Team Leadership: Lead and mentor a hands‑on packaging team (2+ engineers), planning workflows and ensuring efficient project execution.
Advanced Packaging Processes: Develop and execute high‑precision fiber‑to‑chip coupling strategies, focusing on maximizing coupling efficiency and stability at cryogenic temperatures.
Assembly & Integration: Perform and oversee critical assembly steps including chip attachment and wire bonding, ensuring reliability under extreme thermal cycling.
Thermal & Mechanical Design: Design submounts and packaging interfaces. Address thermal management challenges, calculating and mitigating mechanical stress caused by CTE (Coefficient of Thermal Expansion) mismatches between chip, submount, and adhesive layers at 2 K.
Process Optimization: Transition manual packaging steps into automated processes.
Interface with Design: Collaborate closely with the PIC design team to optimize Mode Size Converters and spot sizes for improved coupling tolerances.
Strategic Sourcing: Select and qualify materials (epoxies, solders, submounts) suitable for cryogenic environments.

Your profile

Education: Master’s degree or PhD in Engineering, Physics, Photonics, or a related field.
Industry Experience: Several years of professional experience in the photonic packaging industry, ideally gained at specialized packaging service providers, photonic foundries, or optical assembly houses.
Technical Expertise:
- Deep understanding of PIC Packaging (Fiber array attachment, Flip‑chip, Wire bonding).
- Proven experience with cryogenic packaging or packaging for harsh environments is highly desired.
- Solid knowledge of thermal management and material properties (CTE) at low temperatures.
- Familiarity with PIC design principles (especially Mode Size Converters) to guide the design team on packaging constraints.
- Leadership: Experience in technically leading small teams or projects.
- Mindset: You are a “hands‑on” leader who enjoys working in the lab while also handling strategic planning.

Why us?

What we offer:

Impact: Opportunity to shape the next technological revolution with impact on all industries by enabling quantum technologies.
Compensation: Competitive salary and compensation package above industry standards.
Culture: A team‑centric workplace with flat hierarchies, open communication, and an open‑door policy.
Flexibility: Remote work options and a family‑friendly environment.
Growth: The chance to take on significant responsibility from day one and build your own processes.

As part of our team, you will have the opportunity to take on responsibility and actively contribute at an early stage. Become part of the quantum revolution and submit your application today by using the link below.

Pixel Photonics is a young, growing deep‑tech start‑up from Münster – we develop sensors and detector solutions for sensing faint light signals, down to the single photon level, that are the basis for quantum technologies of tomorrow. As a company we live low hierarchies and a diverse and multi‑national working environment with the opportunity to take over responsibilities on the first day.

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Pixel Photonics GmbH