LevelUP HCS

Senior Camera Hardware Engineer (On-site in Abu Dhabi)

Stellenbeschreibung:

Senior Camera Hardware Engineer (On-site in Abu Dhabi)

Location: Abu Dhabi (Relocation Provided)

Employment Type: Full-Time

Experience Level: 15+ Years

Department: Hardware Engineering – Imaging Systems

Position Overview

We are seeking a highly skilled Senior Camera Hardware Engineer to lead the design and development of advanced camera hardware systems for defense and surveillance applications. This role focuses on delivering high-performance, ruggedized PCB designs for day and thermal imaging platforms, ensuring signal integrity, environmental resilience, and seamless system integration.

Key Responsibilities

  • Lead schematic capture, PCB layout, and SPICE simulation using Altium Designer or similar tools.
  • Design and develop sensor interface boards, power regulation circuits, and digital processing modules for day and thermal camera systems.
  • Create complex multilayer PCBs with high-speed video data transmission, using advanced techniques such as blind/buried vias, via-in-pad, and BGA configurations.
  • Ensure signal integrity and minimize crosstalk through effective analog/digital domain separation.
  • Develop ruggedized PCBs for harsh environments typical in defense and outdoor surveillance.
  • Design low-noise power distribution systems with thermal management and EMC considerations.
  • Integrate interface standards such as MIPI CSI, LVDS, HDMI, and USB into camera modules.
  • Implement EMI/ESD protection, grounding schemes, and shielding for high-sensitivity imaging systems.
  • Produce complete manufacturing documentation including BOMs, Gerber files, assembly drawings, and test plans.
  • Collaborate with firmware and optics teams to align hardware with calibration, synchronization, and system integration needs.
  • Mentor junior engineers and support peer reviews and validation processes.
  • Utilize lab tools such as logic analyzers, oscilloscopes, and thermal cameras for debugging and validation.

Supporting Responsibilities

  • Work with microcontroller, FPGA, and ISP architectures for camera control and data handling.
  • Support integration of thermal sensors (e.g., ULIS, FLIR) and visible image sensors into embedded systems.
  • Apply thermal management techniques and temperature compensation for IR camera hardware.
  • Conduct hardware bring-up, calibration board support, and sensor alignment.
  • Collaborate with systems engineering and testing teams during lab and field trials.

Required Qualifications

  • Bachelor’s or Master’s degree in Electrical or Electronics Engineering.
  • 15+ years of experience in hardware design, particularly in imaging systems and ruggedized environments.
  • Proven track record of successful PCB designs in defense applications.
  • Deep knowledge of Altium Designer and hardware troubleshooting.

Key Skills

  • Thermal and Day Camera Design
  • Defense Industry Standards and Practices

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Stelleninformationen

  • Typ:

    Vollzeit
  • Arbeitsmodell:

    Vor Ort
  • Kategorie:

  • Erfahrung:

    2+ years
  • Arbeitsverhältnis:

    Angestellt
  • Veröffentlichungsdatum:

    04 Nov 2025
  • Standort:

    Berlin

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