Design Team Lead

Lead the Future of Memory. Shape the Next Wave of Chip Design. Drive Breakthrough Silicon Innovation.

Are you a seasoned custom design engineer ready to take the lead at the cutting edge of semiconductor development? Do you thrive where advanced nodes meet embedded memory — and want to help define the next era of high-performance, low-power chips?

A leading global semiconductor company is seeking an experienced Custom Design Team Lead to head up a specialist group developing advanced embedded non-volatile memory (NVM) IP for next-generation technologies.

This is a strategic leadership position in a growing European hub, working on the most advanced process nodes and collaborating closely with international R&D and product teams.

What You’ll Be Doing

• Lead a team developing embedded NVM test chips and IP, ensuring world-class circuit design and layout quality.
• Define design specifications, workflows, and verification methodologies for complex custom circuits.
• Review critical memory paths, schematics, and layouts to optimise performance, area, and reliability.
• Analyse silicon data and debug design issues, collaborating across global engineering functions.
• Coordinate technology specifications, characterisation, and reliability processes with cross‑functional teams.
• Support customer integration, ensuring robust performance across automotive, AI, and industrial applications.

What You Bring

• Master’s degree or higher in Electrical Engineering, Microelectronics, or a related field.
• 10+ years’ experience in custom circuit design, ideally with non-volatile memory (Flash, MRAM, RRAM, PCRAM) or similar analog / mixed‑signal technologies.
• 5+ years in a technical leadership role with demonstrated success in mentoring and project delivery.
• Strong experience with Cadence Virtuoso and modern EDA design flows; confident in verification, layout, and silicon validation.
• A proactive, collaborative mindset with a passion for technical excellence and innovation.

Why This Role

• Lead a high‑impact design team working on next‑generation embedded memory.
• Work at the forefront of advanced node technologies and contribute to global R&D programmes.
• Shape the culture and direction of a new European team from the outset.
• Enjoy a technically rich, collaborative environment where innovation is actively encouraged.
• Attractive compensation, relocation assistance, and long‑term growth prospects in a world‑leading semiconductor ecosystem.

This is a rare opportunity to combine deep technical leadership with hands‑on design impact — bringing next‑generation memory from concept to silicon.

If you’re driven by challenge, collaboration, and innovation, we’d love to hear from you.