IC Packaging Engineer

Head of IC Manufacturing Recruitment at microTECH Global LTD

Location: Stuttgart, Germany - Onsite working required

Must have the right to work in Germany.

As an IC Package Development Engineer, you will:

• Package Selection & Analysis – Select appropriate IC package types based on specifications and IC requirements; analyze electrical characteristics; identify potential limitations.
• Electrical Performance Optimization – Enhance electrical performance focusing on signal integrity, power integrity, and EMC; analyze routing, parasitics, and noise issues; propose design improvements.
• Design for Manufacturability & Cost Optimization – Review designs for manufacturability, assembly requirements, and materials availability; suggest cost-effective modifications.
• Documentation & Reporting – Deliver detailed reports, including diagrams, simulations, calculations, and results; clearly communicate design decisions and their impact.

What We Offer:

• The opportunity to join a leading research center in nanotechnology, shaping future automotive technologies.
• A collaborative, multicultural, and inclusive working environment where initiative and responsibility are encouraged.
• Support for your technical and personal growth through dedicated development programs.
• A competitive and market-appropriate compensation package recognizing your expertise and commitment.

Who You Are:

• MSc in Electronics or a related field with at least 5 years of experience in packaging design and SIPI analysis.
• Proficient in Cadence layout tools and Ansys simulation tools.
• Skilled in 2.5D/3D packaging and backend silicon layout (place & route).
• Strong communication skills in English (mandatory).

Please get in touch with Christina McGuire to hear more about this position.

Seniority level

Mid-Senior level

Employment type

Full-time

Job function

Manufacturing and Engineering

Industries

Semiconductor Manufacturing

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