The Fraunhofer Institute for Reliability and Microintegration (IZM) is a world-leading research institute in the field of packaging and interconnection technology for microelectronic systems. The industries represented by our customer base are as diverse as the possible applications of electronics. We are looking for five motivated researchers to join an interdisciplinary team focused on strengthening the scientific landscape of the institute. You will be part of an innovative project in the field of High Performance Computing, with an emphasis on scientific work rather than client project work. All five team members will start together and collaborate closely to achieve significant advancements in research. Are you interested in topics such as chiplet-based heterointegration, system simulation & design (System-Technology-Co-Optimization: STCO), AI-driven data analysis and process assessment, packaging-specific PDKs & ADKs, or inline testing & fault analysis (3D)? If so, you are in the right place!
We value and promote the diversity of our employees' skills and therefore welcome all applications – regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in case of equal suitability.
Interested? Apply online now. We look forward to getting to know you!
Fraunhofer Institute for Reliability and Microintegration IZM
Number: 81607
Application Deadline: 12/31/2025
Veröffentlichungsdatum:
11 Dez 2025Standort:
BerlinTyp:
VollzeitArbeitsmodell:
Vor OrtKategorie:
Erfahrung:
2+ yearsArbeitsverhältnis:
Angestellt
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