Senior Research and Development Expert for BEOL Integration (fmdiv.)

Stellenbeschreibung:

As a leading expert in Backend of Line (BEOL) process technology you will bring your extensive expertise in process integration (Thick Wire Cu Vias Plating) directly into our product development.

In this expert role you will be instrumental in the strategic development and implementation of future-oriented BEOL process flows
You will act as a leading technical specialist and mentor for cross-site development teams in the context of 300mm processes and your expertise will contribute decisively to the success of our sensor technologies
As a recognized expert you will actively promote knowledge transfer within the team and the company provide technical guidelines and serve as a central point of contact for complex technical challenges
You will shape the strategic roadmap for BEOL sensor process technologies and be significantly involved in the selection and evaluation of new concepts materials equipment and methods to secure our technological leadership
You will consolidate critical technology projects for modern sensor technologies from conception to series production readiness including defining project goals resource planning and risk management
You will maintain close constructive and interdisciplinary exchange with specialist departments such as individual process development design layout and manufacturing to ensure continuous improvement of our processes and products
You will actively monitor the market and scientific developments in BEOL technologies identify trends and potentials early on and integrate these insights into our strategy

Qualifications

Personality and Working Style: You are a recognized expert who skillfully integrates specialized knowledge and acts in a solution-oriented manner; You are enthusiastic about technological innovations approach changes with clarity and courage and are able to make well-founded decisions
Experience: At least 10 years of profound professional experience in the integration of modern ASIC technology with an explicit focus on the Backend of Line area; You proved the ability to solve problems at the highest technical level and experience in applying statistical process control methods (SPC) and Design of Experiments (DoE)
Expertise: Deep and demonstrable technical knowledge in the following areas: Thin-film technologies: PVD PECVD (Frontside/Backside/Edge) Plating (e.g. Cu Ni Fe Pd); Lithography: Thick resist technologies on wafers with strong topography or 3D structures; Etching technologies: Dry etching (RIE ICP-RIE DRIE) for various materials (Si SiO2 SiN metals) Wet etching; Planarization techniques: CMP (Chemical Mechanical Planarization) for layer planarization and stress reduction; Dielectrics: low-k dielectrics intermetal dielectrics (IMDs) passivation layers (SiN SiO2); Wafer bonding technologies
Languages: Fluent English German beneficial
Education: Completed university degree (Masters or PhD) in Microsystems Technology Electrical Engineering Physics Chemistry Materials Science or a comparable field of study

Additional Information

We offer flexible working models: from various part-time options to mobile working and job sharing. Feel free to contact us.

Diversity and inclusion are not just trends for us but are firmly anchored in our corporate culture. Therefore we welcome all applications regardless of gender age disability religion ethnic origin or sexual identity.