Thermo-Mechanical Modeling Engineer

Position

Thermo‑Mechanical Modeling Engineer at Corintis

Location

Munich, Bavaria, Germany

Overview

We are seeking a Thermo‑Mechanical Modeling Engineer to design and analyze high‑performance thermal test vehicle (TTV) modules in HVM and other cooling solutions for Corintis’ liquid cooling products. The role focuses on building realistic models of complete modules, including packages on PCBs, and proposing improvements based on thermo‑mechanical stress analysis.

Key Responsibilities

• Setup of thermo‑mechanical models for packages (from simple FlipChip to advanced multi‑die package with interposer).
• Characterize stresses and strains within the package and its PCB interface during assembly and operation with cold plates or custom cooling solutions.
• Determine warpage values and calculate expected lifetime of interfaces based on the thermo‑mechanical stresses and strains.
• Develop experimental verification, validation and correlation strategies for simulation‑predicted results.
• Work closely with reliability experts to develop a robust model‑to‑hardware correlation.
• Present modelling results to the product development team, highlighting risks and improvement opportunities.
• Support the product development team during the design phase with expert advice.
• Collaborate with internal and external partners for modelling setup, result comparison and material parameter identification.

Qualifications

• Education: M.Sc. in Mechanical Engineering, Microengineering, Materials Science, or a related field (PhD is a plus).
• Minimum of 5 years of industrial experience in thermo‑mechanical modelling of electronic systems, multilayer PCBs, and complex modules.
• Expertise in Abaqus, SimScale, or similar thermo‑mechanical modelling tools is strongly preferred.

This role fits you if

• Knowledge of solid mechanics, heat transfer, failure modes and thermo‑mechanical interactions of materials.
• Hands‑on experience designing and building measurement sets for characterization and validation of packaging designs.
• Previous experience with finite element simulation tools for semiconductor packaging.
• Experience in designing, organizing, and managing experiments and related activities.
• Proficiency in data analytics.
• Demonstrated ability to produce clear, high‑quality technical documentation.
• Strong communication and interpersonal skills, able to collaborate with diverse teams.
• Autonomous and proactive working style with excellent organization and ethics.
• Fluent in English.
• Available to travel frequently to the headquarters in Switzerland, including a three‑month onsite period in Lausanne for onboarding.

What won’t be right for you if

• You prefer strictly to follow fixed processes without deviations.
• You do not want to deeply understand model‑realism discrepancies.
• You want to work alone on relaxed tasks with “good enough” solutions.
• You prefer working mainly from home.

Travel Requirements

Candidate must be willing to travel frequently to our headquarters in Switzerland and spend the first three months onsite in Lausanne.