Thermal-Mechanical Simulation Engineer for Automotive Electronics (imec Germany)

Thermal-Mechanical Simulation Engineer for Automotive Electronics (imec Germany)

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Thermal-Mechanical Simulation Engineer for Automotive Electronics (imec Germany)

As a Thermal-Mechanical Simulation Expert, you will play a crucial role in the design and optimization of electronic packaging solutions for automotive applications.

The automotive industry is at a turning point with advanced chiplet technology paving the way for autonomous driving and connected vehicles. Imec and the State of Baden-Württemberg are establishing a joint project to support the local and international automotive industry in derisking and accelerating the introduction of automotive chiplets into manufacturing.

In our new Advanced Chip Design Accelerator (ACDA) competence center, based at the Innovation Park AI (IPAI) in Heilbronn, we will be pushing the boundaries of what’s possible and accelerating the future of automotive. By leveraging imec’s world-leading expertise in semiconductor technology and packaging, we will be building the chiplet-based solutions that will power the vehicles of tomorrow to be smarter, safer, and more efficient.

What you will do

• Perform thermal and mechanical simulations of electronic packaging using industry-standard software tools.
• Analyze simulation results to identify potential issues and optimize designs for thermal and mechanical performance.
• Develop and validate simulation models to predict the behavior of electronic packages under various conditions, including conducting experimental validation and material characterization.
• Stay updated with the latest advancements in thermal-mechanical simulation techniques and tools, such as AI-based computational learning and prediction techniques, to enhance simulation accuracy and efficiency.
• Prepare detailed reports and presentations to communicate simulation findings and recommendations to stakeholders.
• Collaborate with cross-functional teams, including design, manufacturing, and quality assurance, to ensure seamless integration of simulation insights into product development.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at our office in Heilbronn, Germany. With your talent, passion, and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample opportunities to take initiative and show responsibility. Through imec.academy, our corporate university, we actively invest in your development to further your technical and personal growth.

We recognize that your valuable contributions make imec a top player in its field. Your energy and commitment are appreciated and rewarded with a market-appropriate salary.

Who you are

• Master's or Ph.D. in Mechanical Engineering, Material Science, or a related field.
• Proven experience in thermal and mechanical simulation of electronic packaging.
• Proficiency in simulation software such as ANSYS, COMSOL, or similar tools.
• Strong understanding of material physics, mechanical behavior, heat transfer, and fluid dynamics.
• Experience with experimental validation of simulation results.
• Experience with AI-based computational modeling is a plus.
• Excellent problem-solving skills and attention to detail.
• Ability to work effectively in a team and communicate complex technical concepts clearly.

Seniority level

• Associate

Employment type

• Full-time

Job function

• Research Services, Nanotechnology Research, and Semiconductor Manufacturing

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