Reseach Associate for Interconnect Technologies (all genders)

Stellenbeschreibung:

Developing innovative technology solutions and bringing them to application - that is our goal at the Fraunhofer Institute for Photonic Microsystems IPMS.

Our »Center Nanoelectronic Technologies« (CNT) conducts research on 300 mm wafers for microchip manufacturers, suppliers, device manufacturers, and R&D partners. We offer process and technology developments as well as services at the ULSI (ultra-large-scale integration) level in the areas of front-end (FEoL) and back-end-of-line (BEoL) for various CMOS technology nodes.

The associated Interconnect Technologies group, which is part of our Neuropmorphic Computing business unit, focuses on technologies for metallization in the BEOL (back end of line) of CMOS manufacturing and the border area to advanced packaging. The core theme of the group is the creation of copper lines through electrochemical deposition (ECD) and chemical mechanical polishing (CMP), as well as all wet chemical cleaning steps.

Be part of change

Research and development in the field of interconnect technologies
BEOL process integration of existing UPD solutions to set up a complete BEOL metallization module
Evaluation and potential development of novel metallization solutions
Evaluation and responsibility for complex project ideas with regard to feasibility and the associated measures in the 300mm cleanroom
Development of synergies between classic BEOL technologies and advanced packaging, in particular silicon interposer technologies
Scientific supervision of existing CMP processes and development of new solutions
Project management and acquisition for industrially and publicly funded projects
Scientific exchange and presentation of research results at conferences and participation in workshops

What you contribute

Completed university degree (master's/diploma) in microelectronics, materials science, electrical engineering, physics, or a comparable field
Three to five years of previous professional experience or a completed doctorate
Know-how in the field of semiconductor manufacturing technologies , especially in BEOL or BE, preferably on HVM equipment platforms, e.g.:
- Thin film deposition (PVD)
- Chemical mechanical polishing (CMP)
- Advanced packaging
- BEOL process integration
In-depth expertise in working with industrial partner companies
Experience in project management ; ideally with responsibility for acquiring publicly funded projects and direct industrial contracts
Great knowledge of common analysis and measurement methods
Independent and proactive approach to work with a focus on reliability and precision
Pragmatic, flexible approach to work – especially in the event of unforeseen project changes
Enthusiastic and friendly personality with a strong interest in working in a research environment
Strong communication skills with good German (B level) and very good English (C level)

What we offer

Our benefits:

Attractive and international working environment in an innovative industry of the future
Extensive and varied training and qualification opportunities
Work-life balance thanks to flexible working hours and the option of mobile working
Company pension scheme
Job ticket for public transport
30 days vacationCorporate benefits

An overview of all benefits and other good reasons to join us can be found here.

We offer female scientists the opportunity to participate in our TALENTA program: a comprehensive career and development program that includes individually tailored qualification offers. You can find out more here.