Strategic Technology Lead – Advanced 3DIC Packaging & Integration (Mobile/STCO)

Huawei Heisenberg Research Center (Munich) is responsible for advanced technology research, architectural development, design and strategic engineering of our products.

We are a chip platform team in Munich research center. We keep growing together with our continuous business success and strong partnership, and welcome all excellent experts and talents to join us.

Strategic Technology Lead – Advanced 3DIC Packaging & Integration (Mobile/STCO) (m/f/d)

Your mission

• Evaluate emerging technologies and their commercial potential through in-depth research, including literature reviews, technology trend analysis, and simulations.
• Produce high-impact technology analysis reports for senior leadership (chief scientists, executives, and decision-makers) to guide strategic direction.
• Conduct early-stage feasibility studies and simulations to shape technical roadmaps.
• Define and drive corporate & business unit (BU) innovation programs, ensuring alignment with long-term objectives.
• Manage the international network and engage with external partners, including researchers, suppliers, and ecosystem collaborators, to foster innovation.
• Influence product development strategies across cross-functional teams.
• Support prototyping efforts for preliminary technical assessments when required.
• Organize and facilitate internal seminars/workshops, maintaining active technical exchanges with academic and industry partners.

Your areas of expertise

• PhD in relevant field with substantial experience in industry.
• Technical expertise in one of more the following domains: STCO for highly heterogeneous 3DIC in specific application segments (computing/AI, mobile device, etc.); design and optimization of 3DIC on architecture level (processor or SoC); physical design of 3DIC; advanced packaging for 3DIC; power integrity and signal integrity in 3DIC.
• Strong analytical mindset – capable of tackling both high-level strategic challenges and deep technical details.
• Self‑driven learner – stays ahead of emerging trends in technology.
• Exceptional communication & persuasion skills – thrives in ambiguous, fast‑paced environments.
• Project leadership – ability to steer cross‑functional teams toward well‑defined goals.
• Collaborative approach – works effectively with diverse engineering teams, fostering knowledge sharing and providing clear updates to stakeholders.
• Willingness to travel – occasional trips within Europe and internationally for conferences and partner engagements.
• Relationship‑building – cultivates strong partnerships with internal and external stakeholders.
• Fluency in English (written & spoken).
• Proficiency in PowerPoint & Excel – able to distill complex concepts into clear, impactful presentations.

Your rewards of working here

• Our culture is characterized by innovative power and team spirit as well as the intensive exchange of knowledge and experience within our global network.
• We offer healthy meals ranging from traditional Chinese to western delicacies in our famous company canteen.
• To keep your development ongoing, you will find a broad range of training opportunities. Many online and face‑to‑face training programs incl. language courses in German and Mandarin.
• Our diverse and welcoming environment is shaped by different backgrounds and around 40 individual nationalities.
• Self‑responsible work in a competent, motivated and constantly growing team.

If you are passionate about advanced 3DIC technology and meet the above qualifications, we would love to hear from you.