You will lead 3D product development for cross-brand vehicle electronics platforms, focusing on modular, scalable hardware integrated with electrical systems. In Munich, you will collaborate with HW, harness, system engineering, and manufacturing teams to ensure optimal packaging, installation, and data quality. You will shape design rules, support DFx/DFM, and drive ECR/ECO changes to maintain consistency across assemblies. This role offers impact in advancing platform capabilities for multiple brands within a German OEM.
VerantwortungsbereicheVeröffentlichungsdatum:
14 Sep 2026Standort:
MünchenEinsatzort:
GermanyTyp:
VollzeitArbeitsmodell:
Vor OrtKategorie:
Erfahrung:
2+ yearsArbeitsverhältnis:
Angestellt
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