Board-Level Reliability Research Engineer - Simulation and Testing (m/f/d)

As a Simulation and Testing Engineer, you will develop methods to boost reliability across chip-package-board-system integration. You’ll tackle material integration, thermo-mechanical responses and system-level challenges using multi-physics simulations and non-destructive testing. You’ll drive validation and technology transfer with HQ, while shaping test strategies for board-level reliability. This role offers opportunities to lead European collaborations and impact next-generation packaging and integration.

• healthy meals in canteen
• broad training opportunities
• language courses (German and Mandarin)
• diverse international environment
• self-responsible work
• global network exposure

• Advance CPBSI modeling using large-scale simulations, exploring model order reduction and AI-assisted approaches
• Conduct PCBA mechanical stress simulations and contribute to test verification research
• Develop non-destructive testing validation for design reliability (crack/delamination, bond line thickness, in-situ stress/strain)
• Create and execute reliability test plans for board-level integration (thermal cycling, mechanical stress, humidity, electrical evaluation)
• Lead technology planning and coordinate with European research and industry partners
• Validate new simulation/test technologies with HQ and apply them to real applications

• M.S. or higher in Mechanical or Electrical Engineering (PhD preferred)
• Strong understanding of simulation and characterization in chip-package-board-system contexts
• Experience in stress simulation of PCBA and mechanical components/assemblies or with FEM tools or NDT principles
• Experience with model order reduction, AI-assisted simulation and coding (Python, Fortran) a plus
• Established European research/industrial collaborations or willingness to build them
• Able to work in teams and independently; strong communication; travel willingness in Europe and China
• Fluent English

• team collaboration
• excellent communication
• travel readiness
• finite element simulation tools
• non-destructive testing
• PCBA stress simulation