Development Engineer and Project Lead PowerGaN Metallization (f/m/div)

In this role you will develop Cu metallization and pad technologies for GaN-based power semiconductors and lead BEOL projects across multiple sites. You’ll drive process concepts from concept to production transfer, collaborating with international teams to optimize stability, yield, and cost. This position offers hands-on technical leadership in a global, cross-site environment and a chance to shape next-gen metallization for power devices.

• Develop 300 mm front-end Cu metallization and pad technologies for GaN-based power devices from concept to production transfer
• Lead BEOL technology development projects in Dresden and support fast time-to-market initiatives
• Drive metallization concepts with focus on stability, yield, reliability and manufacturing costs
• Collaborate with process development engineers to define and optimize process requirements
• Work in multinational teams with project management in Villach and team leadership in Regensburg

• University degree in Microsystems Engineering, Electrical Engineering, Physics, or related field
• ≥5 years in process technology development/integration, ideally in semiconductor metallization
• Proven technical leadership and project management skills
• High initiative, ownership, and motivation
• Strong communication and collaboration in international environments
• Fluency in German and English

• initiative
• leadership
• collaboration
• GaN-based power semiconductor metallization
• 300 mm front-end metallization
• process concept to production transfer