IPU Packaging Expert

About the Role

We are seeking an experienced Power Semiconductor Packaging Design Engineer to lead the development of next-generation power module solutions. This role is central to our product innovation, spanning material selection, structural design, multi-physics simulation, and reliability validation.

Key Responsibilities

• Lead power semiconductor packaging material selection, structural design, and multi-dimensional electro-thermal-mechanical stress analysis; drive critical packaging process development and reliability assessment.
• Proficient in mechanical stress and thermal simulation throughout power module development; utilize simulation tools to optimize module design and rapidly identify technical issues.
• Stay abreast of industry trends, emerging packaging technologies, and new design methodologies.
• Expertise in packaging material selection and full process flow, including die attach, wire bonding, vacuum soldering, molding, vacuum potting, and testing.
• Facilitate internal and external technical communication during R&D phases, including cross-functional collaboration and supplier engagement.

Qualifications

• Master's degree or above in Microelectronics, Power Electronics, Integrated Circuits, or related Electrical/Electronic Engineering fields (exceptional candidates may be considered regardless of degree).
• 5+ years of hands‑on experience in semiconductor packaging design.
• Proficiency in packaging design software such as PTC Creo, SolidWorks, or CAD; demonstrated capability in thermal stress, structural, and mechanical stress simulation analysis.
• Excellent communication and interpersonal skills; proven experience in cross‑functional coordination and stakeholder management.