Master's Thesis: Modeling and Simulation of Wafer Bonding Process

Overview

The Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes. Wafer bonding is a critical process in semiconductor manufacturing, enabling the integration of diverse materials and the creation of complex microsystems. A key phenomenon in this process is the bond wave – the progression of the bonding front across the interface.

We are looking for a motivated Master’s student to develop a comprehensive numerical framework to predict bond wave propagation to start as soon as possible. This thesis aims to bridge the gap between traditional analytical models and advanced computational methods, specifically focusing on Finite Element Method (FEM).

Responsibilities

• FEM Development: Develop and refine a Finite Element model to simulate the dynamics of the wafer bonding process.
• Validation: Compare simulation results with existing experimental data to ensure model accuracy and reliability.
• Interdisciplinary Collaboration: Work closely with the System Packaging and Simulation of Semiconductor Technologies departments to align simulation parameters with physical process constraints.

What You Contribute

Core Requirements

• Possible fields of study: Microsystems Engineering, Electrical Engineering, Physics, Materials Science, Nanotechnology, Semiconductor Technology, or related disciplines.
• Enrolled student in Chemnitz, Mittweida or the surrounding area.
• Analytical Skills: Solid understanding of mechanics and wave propagation.
• Programming: Proficiency in Python for analytical modeling and data processing.
• Strong English and German reading and comprehension skills.
• An average grade of

Preferred Qualifications (Plus)

• FEM Software: Experience with COMSOL Multiphysics, ANSYS or a similar software.
• Domain Knowledge: Previous exposure to wafer bonding processes or semiconductor manufacturing technology.
• Scientific Writing: Ability to document complex technical results clearly in English or German.
• Machine Learning: Basic knowledge and demonstrated skills / awareness regarding surrogate models.

What We Offer

• An interdisciplinary research environment at the intersection of simulation and high-end semiconductor hardware.
• Access to state-of-the-art simulation tools and experimental data.
• Dedicated mentorship from experts in both packaging and semiconductor technology.
• Flexible working hours, which will allow you to combine your studies with your practical work.
• A collegial, pleasant and motivating working environment.

Diversity and Inclusion

We value and promote the diversity of our employees\' skills and therefore welcome all applications – regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability. Our tasks are diverse and adaptable – for applicants with disabilities, we work together to find solutions that best promote their abilities.

About Fraunhofer ENAS

With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.

Application

Please enclose a brief cover letter, your CV, a current overview of your grades and your certificates with your application.

The information above is provided for positions that are open for candidacy; applications are processed through the Fraunhofer career portal. For data protection reasons, we can only consider applications via our career portal.

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