New Product Manufacturing Engineer (m/f/d)

In this role, you will support the development and release of complex product structures and manufacturing processes for advanced semiconductor modules. You will collaborate with cross-functional teams to optimize BOMs, testing, sourcing, and change-control activities that drive cost, quality, and cycle-time improvements. You will apply solid modeling and digital analysis tools to validate designs and participate in design reviews to push for manufacturability and efficiency. This position offers hands-on problem solving with impact on product introductions and continuous improvement within a global leader in materials science.

• comprehensive benefits package
• bonus potential
• stock award program
• relocation eligibility
• travel opportunities (up to 10%)
• competitive salary range

• Develop, implement, and release new product BOMs for complex modules and product structures
• Collaborate with stakeholders to define and execute manufacturing, test, and sourcing strategies
• Develop and validate Operation Method Sheets (OMS) for medium-complexity modules
• Perform 3D solid model analysis, including Master Layout (MLO) and Digital Mock Up (DMU)
• Participate in design reviews, providing DFA/DFTe/DFTp, ITO, and efficiency feedback
• Coordinate change requests and manage change-control processes (NSRs, ECOs, CCB, SPSs, ESWs)
• Document product issues and conduct RCCA; lead LTCA resolution for projects
• Lead the managed build process for programs/projects
• Provide technical support and training to manufacturing resources and suppliers
• May perform other duties as assigned

• Intermediate knowledge of NPME role
• Experience in BOM development and release for complex modules
• Experience with design reviews and manufacturing/process improvement
• Familiarity with change-control processes (ECOs, NSRs, CCB) and RCCA/LTCA
• Ability to work with cross-functional teams and suppliers
• Willingness to work in environments with noise, clean rooms, and PPE requirements

• collaboration
• problem solving
• communication
• 3D solid modeling
• Master Layout (MLO) and Digital Mock Up (DMU)
• DFA/DFTe/DFTp and ITO techniques