Stellenbeschreibung:
In this role you will design the next iteration of SEMRON's 3D in-memory compute chip. You will collaborate with hardware, software, and ML engineers to optimize ML workloads on capacitive analog in-memory matrix-vector units. You will specify core architecture modules, partner with the software team to judge performance, and identify constraints to inform architecture. You will track AI hardware trends to guide future architectures, contributing to scalable, energy-efficient accelerators. This is a chance to help push the boundaries of in-memory AI compute at SEMRON.
Verantwortungsbereiche- Design and specify core architecture module structures
- Collaborate with software team to assess performance and inform architectural choices
- Monitor AI hardware/architecture trends to guide evolution of architectures
- BS/MS/PhD in EE, CS, or related field
- Understanding of computer architecture, digital design, and micro-architecture concepts
- Familiarity with AI/ML algorithms, frameworks, and workloads
- Programming in C/C++ and Python
- collaboration
- ability to evaluate trade-offs
- communication with cross-functional teams
- C/C++
- Python
- computer architecture
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Veröffentlichungsdatum:
24 Sep 2026Standort:
DresdenEinsatzort:
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VollzeitArbeitsmodell:
Vor OrtKategorie:
Erfahrung:
2+ yearsArbeitsverhältnis:
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