Product Engineer (m/f/d)

In this role you will drive the development and validation of buck converter products, bridging design, manufacturing, and field performance. You’ll work with cross-functional teams to ensure cost-effective, reliable IC products from development to production ramp-up. You will influence packaging, qualification, and reliability strategies to meet customer needs. This is an opportunity to impact automotive, industrial, and consumer electronics with innovative power management solutions.

• competitive salary
• yearly profit sharing
• flexible working hours
• unlimited contract from the beginning
• international travel opportunities
• additional benefits

• Lead new product development (NPI) with focus on packaging, assembly/manufacturing, and reliability qualification for transition to high-volume production
• Collaborate with design, test, systems, marketing and applications teams to define projects based on customer needs
• Set up and qualify products within TI manufacturing processes and flows
• Drive reliability testing to meet customer environment lifetime requirements and analyze stress impacts
• Perform root cause investigations and define fixes for assembly and qualification issues
• Coordinate with global manufacturing sites and other product development functions to deliver a complete product
• Communicate across TI’s worldwide network and build strong cross-functional relationships
• Understand IC components from physical to electrical perspective to enable reliable mass production while balancing cost and quality
• Contribute to new technology development, cost reductions, capacity expansion, yield improvements and quality enhancements
• Ensure quality and performance of TI IC products by defining and maintaining all aspects beyond the silicon

• Strong understanding of semiconductor device physics and materials science
• Experience with semiconductor fabrication processes, manufacturing flows and reliability testing
• Excellent problem-solving and analytical skills; ability to work in a fast-paced global team
• Strong verbal and written communication in English; German is a plus
• Team player with ability to collaborate across functions and establish stakeholder relationships
• Understanding of IC packaging and failure analysis is a plus
• Basic experience with Python development and Claude Code
• Experience with Ansys, Cadence or similar modelling/simulation tools
• Ability to ramp on new processes quickly and drive for results
• Strong time management for on-time project delivery
• High motivation for continuous learning

• cross-functional collaboration
• problem-solving mindset
• effective communication
• semiconductor device physics
• IC packaging and failure analysis
• reliability testing