Semiconductor Process Development Engineer

Our team is well established in the (power) semiconductor industry, recognized for its expertise and continuous innovation in automotive-grade semiconductor technologies and power module packaging applications.

With a strong focus on research and advanced technologies, we have built a solid track record in developing (power) semiconductor solutions and driving progress in power module design and manufacturing.

We are looking for passionate individuals who are eager to push the boundaries of (power) semiconductors and semiconductor packaging technologies, and to contribute to impactful engineering work within our team.

Join us and be part of an exciting journey shaping the future of power semiconductors.

Duties and responsibilities

• Conduct literature research and Design of Experiments (DoE) to support the development of SiC semiconductor die attach processes (e.g., sintering, soldering, embedding).
• Perform process development for power module-to-heatsink interconnection and evaluate new material processes, including literature review, DoE design, and technical discussions with suppliers and partners. Operate advanced packaging manufacturing equipment, including:
  • Printing systems (e.g., paste, solder, sinter materials)
  • Sintering equipment
  • CNC machining and laser processing tools
• Perform failure analysis and quality inspection using tools such as:
  • CSAM (C-Scan Acoustic Microscopy)
  • Optical microscopy and other characterization tools
• Generate structured technical reports and documentation.
• Support cleanroom setup, including equipment installation, qualification, and commissioning.
• Investigate and develop new materials, processes, and technologies, and contribute to process roadmaps for next-generation power modules and other semiconductor application fileds.
• Coordinate with external partners and suppliers, organize technical meetings, and prepare meeting minutes and progress reports.

Requirements

• Master’s degree or higher in Materials Science, Chemical Engineering, Semiconductor Engineering, MEMS/Microelectronics, Power Electronics, or related fields.
• 3–5 years of relevant industry or research experience in semiconductor processing or advanced packaging, strong semiconductor knowledge and background.
• Strong self-motivation and a results-driven mindset; with strong curiosity and a passion for learning; demonstrates a proactive, ownership mindset with disciplined use of R&D resources and a strong ambition to deliver high-impact results and contribute to shaping the future of the industry.
• Hands-on experience with manufacturing/prototyping equipment in semiconductor industry or semiconductor packaging is highly preferred, cleanroom working experience is a plus.
• Experience in mechanical design, including: Engineering drawings Tolerance analysis Fixture/jig design Module/package design is a plus.
• Fluent English is required as the working language.
• Experience using AI agents/tools to increase working efficiency is a plus.