Senior Engineer – RF Packaging / High-speed / 6G / EM Simulations

We are looking for a Senior Engineer to join a world leading technology company at their technology centre in Greater Munich Metropolitan Area .

You will be involved in the development of high-performance packaging architectures for next-generation telecommunications and high-speed data systems. You will be at the forefront of bridging cutting-edge research with commercial viability, ensuring our hardware meets the rigorous signal integrity and thermal demands of 5G-A, 6G, and electro-optical applications.

As a Senior Engineer your responsibilities will include:

• Architectural Strategy: Lead the definition and maturation of RF/high-speed packaging solutions, focusing on performance optimization for passive/active devices and electro-optical co-packaging.
• Technical Interface: Serve as the core bridge between research teams and business units, translating complex feasibility requirements into optimized, high-speed package designs.
• Lifecycle Ownership: Manage the complete development process from initial conceptualization to manufacturing handoff, ensuring a holistic balance of thermal, mechanical, and electrical constraints.
• Innovation & Gap Analysis: Scout the technological landscape for emerging packaging trends and implement innovative strategies to overcome current hardware limitations.
• Strategic Partnerships: Cultivate relationships with European research hubs and suppliers to facilitate the rapid adoption and commercial scaling of new packaging technologies.
• Technical Support & Troubleshooting: Partner with global cross‑functional teams to troubleshoot production‑level issues and support the rollout of new product applications.

As a Senior Engineer your skills will include:

• Master's or PhD in Electrical Engineering, Physics, Telecommunications, or an equivalent technical field
• 5+ years in RF/high-speed device packaging, with a clear understanding of production methodologies
• Proficiency in circuit design software (e.g., Keysight ADS, Cadence/AWR) and 3D electromagnetic simulators (e.g., Ansys HFSS, CST Studio Suite)
• Strong grasp of packaging materials and unit-level fabrication processes
• Proactive, team-oriented mindset suitable for a multidisciplinary and multicultural global environment
• Excellent presentation and technical communication skills in English; proficiency in German or Chinese is considered a significant asset

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