Senior Integrated Photonics Packaging Engineer (Photonics)

Your mission

The future of AI computing is light, not electrons. Q.ANT is building photonic processing systems that compute with light—delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As Senior Integrated Photonics Packaging Engineer within our PIC OPS team, you will take technical ownership of the optical packaging architecture. You will be the technical mastermind behind proprietary, high-density optical packaging solutions that unite Photonic Integrated Circuits (PICs), laser sources, photodetectors, and analog circuitry in semiconductor back-end integration. By defining technical strategies, leading supplier-driven R&D projects, and driving innovation from specification to validation, you will build competitive differentiators that shape the future of AI computing infrastructure.

Your Impact & Responsibilities

• Define and own the optical packaging architecture and high-density packaging solutions for our photonic processing systems
• Lead supplier-driven R&D projects from requirement definition and contract negotiation through to final system integration
• Define and implement advanced optical coupling strategies (butt-coupling, grating coupling, fiber array integration) and thermal management concepts
• Drive Design for Manufacturability (DFM) and material selection (polymers, ceramics, metals) in semiconductor back-end integration
• Perform structured root-cause analysis (8D, Ishikawa) on integration failures to ensure >95% first-pass qualification
• Implement novel packaging concepts and architectures annually to build and protect proprietary Q.ANT IP
• Collaborate closely with internal R&D, systems, manufacturing, and test teams to align packaging with overall product architecture.

Your profile

• M.Sc. or Ph.D. in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field; equivalent industry experience also considered
• 5+ years of hands-on experience in photonics packaging, optoelectronic integration, or high-density interconnect technologies
• Proven track record of managing supplier-led R&D projects from requirement definition through to integration and validation
• Deep hands-on experience with PICs, laser sources, photodetectors, analog electronics, and semiconductor back-end integration
• Solid expertise in optical coupling techniques (butt‑coupling, grating coupling, fiber arrays), thermal management, and DFM
• Proficiency in optical design tools (Zemax, CODE V, or equivalent) and root-cause analysis methodologies (8D, Ishikawa)
• Proactive mindset with strong ownership, high emotional intelligence for supplier management, and a collaborative "team-first" attitude
• Fluent in English; knowledge of German or another European language is a plus

Why us?

• Work on the leading edge: Shape deep-tech evolution by developing proprietary, high-density packaging architectures that push the physical boundaries of computing.
• Make impact at scale: Protect Q.ANT's competitive edge—your DFM strategies and supplier quality controls directly reduce time-to-market risks and ensure high-yield production.
• Broad decision-making authority: Enjoy wide autonomy to define technical requirements, select global suppliers, manage budgets, and bring fresh packaging concepts into reality.
• Fast-track your growth: Solve challenges with few industry precedents—every problem you solve becomes institutional knowledge and potentially industry-defining IP.
• World-class team: Collaborate with an international, cross-functional team of experts in photonics, processor design, and AI systems under the PIC OPS umbrella.
• Direct access to leadership: Work closely with the Head of PIC, company founders, andan advisoryboard that has shaped the semiconductor industry.