Senior Principal System Architect – Integrated Power Products (m/f/d)

As Senior Principal System Architect at Nexperia, you define architectures for next-generation integrated power products, including Smart Power Stages, Hot-Swap Controllers, eFuses, and integrated MOSFET solutions. You translate customer needs into product concepts and specifications, driving differentiated performance. You lead system-level modelling, interaction of gate drivers and MOSFETs, and cross-functional development to deliver scalable power solutions. This high-visibility role shapes the technology roadmap and product direction.

• Define system architectures and product concepts for next-generation integrated power solutions
• Translate system-level requirements into detailed product and MOSFET specifications (efficiency, thermal, reliability, protection)
• Define and validate gate driver and MOSFET interactions including switching performance and parasitics
• Develop system-level electrical, thermal, and performance models to evaluate feasibility
• Identify and resolve technical challenges related to integration, performance, measurement, and reliability
• Collaborate with device design, gate driver design, packaging, applications, validation, and product engineering teams
• Support customer engagements and early-stage evaluations by translating requirements into product solutions
• Lead root-cause investigations and drive improvements for performance and reliability
• Contribute to long-term technology roadmap and strategic product direction
• Provide technical leadership and mentoring across multidisciplinary teams

• 8-12 years of experience in power semiconductors or related field
• Deep understanding of power MOSFET design and operation
• Strong knowledge of gate driver design and interaction with power devices
• Experience with integrated power products (SPS, Hot-Swap Controllers, eFuses) or similar technologies
• System-level power electronics architecture and optimisation
• Experience developing electrical, thermal, and system-level models (SPICE, LTspice, SIMetrix, MATLAB/Simulink)
• Understanding of semiconductor packaging and reliability methodologies
• Strong analytical and problem-solving skills to translate customer requirements into product solutions
• Experience defining semiconductor product architectures from concept through release
• Customer-facing experience in technical discussions and design reviews
• Knowledge of multi-chip and integrated package technologies
• Experience driving cross-functional development projects in a global environment
• Track record of technical leadership in semiconductor product innovation

• Analytical mindset
• Strong communication and interpersonal skills
• Customer-facing experience
• Power MOSFET design and operation
• Gate driver design and interaction with power devices
• SPICE, LTspice, SIMetrix, MATLAB/Simulink modeling