Senior Staff Specialist Package Layout (f/m/d)

As a Senior Staff Specialist Package Layout you will shape the packaging for laminate-based Power Products and PCB modules, balancing performance and cost. You will work with cross-functional teams to design manufacturable layouts and influence reliability and efficiency across products. You will drive DfM throughout layout development and engage with external partners to ensure robust layout releases. You will contribute to innovations in layout automation within Infineon’s global community, helping to advance industry-leading packaging solutions. This role offers impact across product design, manufacturing, and strategic packaging initiatives.

• Develop laminate-based Power Products (Chip Embedding) and PCB module layouts focusing on performance and cost efficiency
• Collaborate with Package Concept Engineering, Product Design & Development, and Simulation teams to optimize packaging solutions
• Lead Design for Manufacturability (DfM) integration in layout processes
• Conduct technical alignment and design reviews with external manufacturers and OSATs to support layout releases
• Contribute to layout automation, generation, and validation within Infineon's global layout community
• Evaluate and implement advanced layout concepts to improve reliability, manufacturability, and product performance

• Master’s degree in Electrical Engineering, Physics, or comparable technical discipline
• ≥5 years of experience in power semiconductor products and PCB/package layout development
• Proficiency with CAD tools and layout environments (AutoCAD, Cadence, K-Layout)
• Strong understanding of laminate materials, PCB technologies, and manufacturing processes
• Collaborative mindset for cross-functional and international teams and external partners
• Fluent English; German beneficial

• cross-functional collaboration
• team-oriented
• communication skills
• AutoCAD
• Cadence
• K-Layout