SMTS Equipment Engineer - Plating (f/m/d)

In this role you will lead plating equipment planning and installation for our Black FabONE facility, driving high-performance interconnect capabilities. You will shape infrastructure, manage tool selection and vendor relationships, and oversee installation, qualification, and maintenance to ensure reliable plating processes. You’ll work cross-functionally to bring up new tools, optimize bath chemistry and deposition uniformity, and implement preventive maintenance. This role offers the opportunity to directly impact manufacturing growth and yield in a cutting-edge graphene-enabled semiconductor environment. You will operate within a human-centered culture that values collaboration, learning

• comprehensive benefits package
• outstanding insurance
• pension
• virtual stock options
• health and well-being focus
• employees first culture

• Act as the plating equipment lead during facility setup
• Define infrastructure needs (chemical handling, plating bath systems, safety compliance)
• Lead equipment selection, technical evaluation, and vendor management for plating tools
• Drive tool installation, bring-up, and process qualification
• Implement preventive and predictive maintenance programs to ensure equipment reliability
• Provide training and documentation for tool operation and safety

• Minimum 5 years of experience with electrochemical plating equipment in a semiconductor fab
• Hands-on experience with new tool installations, fab ramp-up, or expansion projects
• Strong technical knowledge of electrochemical deposition, bath chemistry, deposition uniformity, and plating cell hardware design
• Familiarity with chemical delivery/return systems and safety/environmental protocols
• Strong analytical and problem-solving skills with a focus on reliability and yield
• Effective communication and cross-functional collaboration in cleanroom teams
• Bachelor’s or Master’s degree in a relevant engineering discipline

• cross-functional collaboration
• problem-solving
• strong communication
• electrochemical plating
• bath chemistry
• deposition uniformity