SMTS Process Engineer - Plating (f/m/d)

In this role you will lead the development and deployment of plating processes for 2D materials like graphene, supporting a greenfield fab startup. You will define specifications, validate tools, and ramp processes to production while collaborating with R&D, design, equipment, and facility teams. You’ll establish the Process of Record and implement data-driven improvements to enhance yield and reliability, contributing to scalable graphene-enabled semiconductor technology.

• comprehensive benefits package with outstanding insurance
• pension
• virtual stock options
• health and well-being focus
• flexible work culture
• autonomy and growth opportunities

• Lead development and implementation of plating processes for 2D materials and novel device architectures
• Define process specifications; collaborate with stakeholders and vendors to select and qualify plating tools
• Own fab startup activities: tool installation, acceptance testing, recipe validation, ramp-up
• Establish and maintain Process of Record (POR) for critical clean steps; define ramp-to-production protocols
• Implement and manage SPC systems; drive continuous improvement via data-driven methodologies
• Collaborate with facility and equipment teams for seamless integration into a greenfield fab
• Work with R&D, design, equipment, and facility teams on graphene technology advancement

• Minimum 5 years of hands-on semiconductor process engineering focusing on plating
• Deep understanding of contamination control, surface preparation, and plating challenges
• Proven experience with plating chemistry and hardware
• Practical exposure to 2D material preparation and integration is a strong plus
• 300mm plating tools hands-on experience (Lam, AMAT)
• Experience in fab startup, pilot line development, or technology ramp-up environments is desirable

• collaboration across cross-functional teams
• data-driven decision making
• problem solving and proactive initiative
• plating processes for semiconductor devices
• contamination control and surface preparation
• plating chemistry and hardware