System Architect – Power Modules & Intelligent Power Modules (IPM) | Power Business Unit

L&T Semiconductor is building a next-generation portfolio of SiC and IGBT-based Power Modules and Intelligent Power Modules (IPMs) for Industrial, Energy, Automotive, HVAC, and Data Center applications.

We are looking for a highly experienced System Architect to lead the technical definition and architecture of these products. This is a highly technical role focused on system engineering, product definition, and Build-to-Print handoff to R&D teams.

Key Responsibilities

• Define system architectures for SiC/IGBT Power Modules and IPMs from concept to product definition.
• Own Product Requirement Specifications (PRS), System Requirement Specifications (SRS), and complete Build-to-Print documentation.
• Define electrical, thermal, mechanical, reliability, and functional requirements, including:
  • Voltage and current ratings
  • Efficiency and power density targets
  • Thermal performance and cooling concepts
  • Protection, sensing, and monitoring functions
  • Isolation and gate driver interfaces
  • Reliability and lifetime requirements
• Perform architecture trade-offs and system feasibility studies, including:
  • Electro-thermal modelling and simulations
  • Mission profile and lifetime analysis
  • Design margin and derating methodologies
  • Design-for-Cost, Design-for-Manufacturing, and Design-for-Reliability assessments
• Develop technology roadmaps for:
  • SiC Power Modules (1.2 kV to 6.5 kV)
  • High-frequency and high-power-density power conversion platforms
  • Advanced packaging and cooling technologies
• Serve as the technical interface between customers, Product Management, and R&D organizations.
• Lead architecture reviews, technical risk assessments, validation strategy, and support root-cause analysis during development and customer evaluations.

Desired Experience

12+ years of experience in power semiconductors, power modules, or power electronics systems.

• Deep expertise in:
  • SiC and IGBT devices and modules
  • Power converter topologies and system design
  • Electro-thermal modelling and simulations
  • Semiconductor packaging and thermal management
  • Reliability engineering and mission profile analysis
  • Industrial, Energy, Automotive, HVAC, or Data Center power systems
• Experience with tools such as PLECS, LTspice, MATLAB/Simulink, Simplis, Ansys Icepak, or equivalent.