Team Lead Co-Packaged Optics (m/f/d)

Your mission

The future of AI computing is light, not electrons.

Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As our Team Lead Co-Packaged Optics , you are the architectural and leadership anchor of our next‑generation semiconductor packaging. You will build, coach, and scale a brand‑new CPO Packaging Team from the ground up, driving the transition from concept phase to high‑volume production. This role is about establishing absolute technical ownership at the intersection of photonics and electronics, bridging the gap between internal cutting‑edge chip design and external global OSAT manufacturing.

Your Responsibilities

• Leadership & Team Architecture: Build, mentor, and disciplinarily lead a high‑performing CPO Packaging engineering team; execute gap analyses and strategic hiring to accelerate our scaling roadmap.
• OSAT & Supply Chain Mastery: Own the evaluation, qualification, and end‑to‑end technical management of global OSAT partners, ensuring the secure onboarding of at least two qualified CPO suppliers within 12 months.
• Technical Ownership (CPO & Fiber Attach): Drive the development of advanced co‑packaged photonic/electronic assemblies, mastering deep hardware challenges across optical fiber coupling (Edge Coupling, FAUs), advanced packaging materials, and high‑performance thermal management.
• Design for Excellence (DFM): Bridge the gap between engineering and mass manufacturing by implementing strict Design for Manufacturability (DFM) guidelines and ensuring reliability qualification under JEDEC and Telcordia standards.
• Cross‑Functional Synergy: Act as the critical interface between internal Chip Design, Systems, Manufacturing, Test, and external supply chain stakeholders to ensure a seamless product introduction (NPI) and volume production roll‑out.
• Continuous Engineering Quality: Champion rigorous root‑cause analysis utilizing structured frameworks (8D, FMEA, Ishikawa) to rapidly resolve unexpected reliability or process deviations.

Your profile

• Academic Foundation: You hold a Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a closely related technical field.
• Semiconductor & OSAT Expertise: You possess at least 5 years of profound experience within the Semiconductor Packaging industry (Back‑End / OSAT environment), with a proven track record in global supplier evaluation.
• CPO & Precision Hands‑on Skills: You have direct, hands‑on experience with Co‑Packaged Optics (CPO) packaging, optical fiber attachment methods, and navigating advanced packaging materials (substrates, underfills, TIMs).
• Leadership & Empowerment: You have demonstrated experience in building, scaling, and coaching engineering teams, fostering a culture of high performance and technical accountability.
• Analytical Self‑Leadership: You thrive in high‑growth, innovative environments, demonstrating an advanced solution‑oriented mindset and strong process ownership under tight project milestones.
• Communication Excellence: You possess exceptional written and verbal communication skills; fluency in English is required. Prior experience with glass substrates and proficiency in German are considered a distinct advantage for collaborating with local stakeholders.

Why us?

• We hire for attitude and train for skills.
• We encourage self‑responsibility and accelerate professional development.
• We move fast and encourage experimentation.
• You have the opportunity to be part of developing breakthrough photonic computing technology and have a lasting impact on the future of computing.
• You can be part of a passionate international, highly skilled cross‑functional team.
• You will have access to the founders of the company.