Technical Program Manager (f/m/d)

In this role you lead cross-functional ASIC and chiplet development programs, from concept to production, ensuring milestones, quality, and risk controls are met. You’ll collaborate with product management, suppliers, and external IP partners to translate requirements into executable plans. The position sits at the intersection of electronics and photonics, enabling scalable, energy-efficient chiplet-based systems. This is a hands-on, impact-driven role with a clear path to ownership and delivery.

• comprehensive insurance
• pension
• virtual stock options
• wellbeing focus
• career development
• flexible support for growth

• Lead cross-functional ASIC and chiplet development programs with defined milestones and risk mitigation
• Coordinate electronic and photonic IC programs including multi-die/chiplet integration and qualification
• Translate product requirements into executable program plans and manage scope, dependencies, and schedules
• Own relationships with external IP vendors, qualification providers, and suppliers to align with milestones
• Drive Program Core Team execution and communicate progress, risks, and decisions across teams
• Maintain accurate program documentation and ensure plans and decisions are accessible and current

• Bachelor in Engineering, Computer Science, or a related technical field; or equivalent practical experience
• 5–8 years managing silicon, ASIC, IP, or photonics development programs with lifecycle ownership
• Experience with external IP vendors, qualification providers, or test houses in chiplet/multi-die/advanced packaging environments
• Ability to translate product requirements into executable technical plans and manage milestones, metrics, risks, and dependencies
• Experience leading cross-functional engineering teams and collaborating with Product Management, suppliers, and manufacturing partners
• Hands-on experience with ASIC/silicon development flows, chiplet/multi-die integration, qualification processes, PLM systems, risk management, and supplier coordination
• Strong communication, problem-solving, and stakeholder management skills; ability to work independently in multidisciplinary teams
• Fluency in English; German and Program Management certification are plus
• Knowledge of semiconductor industry trends and disruptive technologies, including chiplet architectures and advanced packaging ecosystems is a plus

• strong communication
• stakeholder management
• problem-solving
• ASIC/silicon development flows
• chiplet/multi-die integration
• qualification processes