At Kandou , we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems - a critical barrier to scalable adoption.Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient . Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency - unlocking unprecedented efficiency for AI training and inference at scale.
The Physical Design (PD) Engineer translates high-speed communication IP digital designs into physical GDSII layouts for advanced FinFET nodes. You will bridge logic design, owning block-to-chip implementation from netlist to final physical sign-off, ensuring PPA (Power, Performance, and Area) targets are met.
Veröffentlichungsdatum:
29 Sep 2026Standort:
RemoteTyp:
VollzeitArbeitsmodell:
Vor OrtKategorie:
Erfahrung:
2+ yearsArbeitsverhältnis:
Angestellt
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