Lead Integrator - NextGenFDX

As Technology Development Lead, you guide a team of Process Integrators to own a process flow that delivers industry-leading performance for GF’s next-generation FDX platform. You drive physical and electrical characterization, design of experiments, and cross-functional collaboration to address complex technology challenges. You will coordinate tasks in volume production, engage with research institutes and customers, and present findings to stakeholders. This role offers impact across development, production, and customer solutions in a cutting-edge facility.

• 13th month salary
• relocation assistance to Dresden
• flexible working time arrangements
• on-site gym
• bike leasing
• subsidized employee restaurant

• Physically and electrically characterize advanced semiconductor features
• Design and analyze experiments to improve performance parameters
• Coordinate technology development tasks in a volume production environment
• Collaborate with cross-functional teams to solve cross-linked technology challenges
• Network with research institutes to bridge research and industry applications
• Collaborate with customers to drive technical solutions
• Define and run technical feasibility studies
• Provide technical support to other teams and departments
• Communicate and present project results to internal and external stakeholders

• M.Sc. in Physics, Electrical Engineering, Materials Science, Chemistry, or other relevant technical discipline (PhD beneficial)
• Profound knowledge of CMOS process integration and key techniques (e.g., CVD, lithography, RIE)
• 5+ years of semiconductor industry experience
• Strong knowledge in Test Chip Design, T/O, Design Rules, Technology-Design Interactions
• Solid foundation in statistics, data analysis techniques and tools
• Ability to work effectively in high-performance cross-functional teams and independently
• Excellent English skills (C1); German proficiency preferred
• Strong interpersonal skills

• strong interpersonal skills
• team collaboration
• communication abilities
• CMOS process integration
• CVD
• lithography