Full-time
At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people’s lives. Our promise to our associates is rock-solid: we grow together, we enjoy our work, and we inspire each other. Join in and feel the difference.
The Robert Bosch GmbH looking forward to your application!
Wafer Grinding is an essential part of micro sensor production process. The primary motivation for modeling and simulating the wafer grinding process is to achieve a deeper scientific understanding and enhanced control over a highly complex and critical manufacturing step. By developing a predictive virtual model, we can move from an empirical, trial-and-error approach to a more efficient, science-based methodology.
Start: According to prior agreement
Duration: 6 months
Requirement for this thesis is enrollment at university. Please attach your CV, transcript of records, examination regulations and if indicated a valid work and residence permit.
Diversity and inclusion are not just trends for us but are firmly anchored in our corporate culture. Therefore, we welcome all applications, regardless of gender, age, disability, religion, ethnic origin or sexual identity.
Need further information about the job?
Uwe Iben (Functional Department)
Work #LikeABosch starts here: Apply now!
#J-18808-LjbffrVeröffentlichungsdatum:
26 Apr 2026Standort:
MalmsheimEinsatzort:
Robert Bosch GmbH, Postfach 30 02 20, 70442 Stuttgart, DeutschlandTyp:
VollzeitArbeitsmodell:
Vor OrtKategorie:
Erfahrung:
2+ yearsArbeitsverhältnis:
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