Package Reliability Engineer (f/m/d)

In this role you own the reliability of packaged products, shaping mission profiles and targets, and driving evidence-based release decisions. You collaborate with cross-functional teams and OSATs to translate use cases into measurable reliability requirements. You will lead failure analysis, qualification planning, and risk-based strategies for innovative packaging tech. Your work helps ensure robust, scalable product releases that meet high-speed and photonics needs. You contribute to a mission-driven environment focused on advancing graphene-enabled semiconductor solutions.

• comprehensive benefits package
• outstanding insurance
• pension
• virtual stock options
• flexible/hybrid work in Aachen
• professional and personal development

• Own mission profiles and reliability targets by defining operating conditions and allocating FIT, MTBF, and lifetime targets across package, interconnect, and device levels
• Assess package reliability risks by evaluating failure mechanisms across substrates, die attach, interconnects, solder joints, board attach, and optical/fiber interfaces
• Define and execute package reliability qualification plans covering thermal, mechanical, environmental, and board-level stress testing per industry standards
• Lead technical interface with OSATs, substrate suppliers, and labs to define requirements and review data
• Lead root-cause investigations and failure analysis, translating findings into CAPA actions and design improvements
• Develop risk-based qualification strategies for novel packaging technologies such as UBC and optical interconnects
• Provide data-driven release recommendations by assessing readiness for sampling, qualification milestones, or production release

• Master's degree in Electrical Engineering (or related field)
• 3–5+ years of experience in evaluating semiconductor package construction and failure mechanisms
• Understanding of high-speed I/O and RF reliability, including impact on signal integrity and eye diagrams; photonics reliability is desirable
• Solid foundation in reliability engineering: FIT/MTBF, mission profiles, acceleration models
• Experience with qualification standards (JEDEC, AEC-Q100/Q006, IPC, IEC) and evidence-based qualification
• Failure analysis expertise with X-ray, C-SAM, cross-sectioning, SEM/EDX
• Ability to collaborate with OSATs, substrate suppliers, and labs and drive technical discussions
• Excellent cross-functional communication; startup-friendly mindset

• cross-functional communication
• initiative and ownership
• adaptability
• X-ray
• C-SAM
• cross-sectioning